A Case Study Using CT Inspection Data

By: Joel F. Flumerfelt, Ph.D., Metallurgist

A client who manufactures copper heat sinks had one returned from their customer that displayed three surface discontinuities, Figure 1. Scanning Electron Microscopy (SEM) examinations conducted on Discontinuity 1 and Discontinuity 2 showed them to be arc spots created by an external energy source, such as may occur during an electrical discharge. The SEM examinations of Discontinuity 3 showed features that were ambiguous. A Scanning Acoustic Microscopy (SAM) inspection performed on Discontinuity 3 indicated an internal void, Figure 1, partially enveloped by delamination, i.e. cracks, within an alumina dielectric material between the top copper layer and the copper substrate, Figure 2.

A Computerized Tomography (CT) inspection of Discontinuity 3 facilitated an additional non-destructive characterization of this internal discontinuity, Figure 3. The permanent, digital CT records provided the possibility to review virtual cross-sections of the void after a destructive analysis. The CT slices showed the void had a spheroidal geometry. The CT slices and clipped isoview images also indicated the presence of a metal “uvula” hanging from the top copper layer and metal “nuggets” laying on the copper substrate. The dielectric material was not apparent in these images due to its low radiopacity relative to the surrounding copper.

The CT inspection, coupled with the complementary SAM data, provided a priori knowledge about how best to orient Discontinuity 3 in a metallographic cross-section to optimize further portrayals of the discontinuity’s physical nature. Without this non-destructive data, an otherwise random cross-section may have destroyed internal features that would truncate an understanding of how and why the void formed.

A cross-section plane through the center of the void showed evidence of solid-state plastic deformation within the grains of the copper metal surrounding the void. The cross-section examinations also revealed the “uvula” and “nuggets” were copper, Figure 4 to Figure 6. The porosity present in these particles was due to them making a transition from a molten state to their solid form. All these features observed in the cross-section were the result of a high energy, explosive event that caused a localized temperature spike in excess of the melting temperature of copper, which is 1,085°C.

A postulated mechanism for the explosive event was an electrical short circuit that took place between the two copper layers. The potential cause of the short circuit path was the presence of copper particles unintentionally embedded in the alumina dielectric material during the fabrication of the heat sink. Evidence to support this opinion was found in the form of another group of copper particles entrenched in the alumina dielectric material, observed elsewhere within the heat sink after peeling away the top layer of copper, Figure 7.

Figure 1

Figure 1 – Physical, non-destructive characterizations of surface discontinuities on a heat sink. Optical image scale is 0.5-mm / division, and the SEM micrograph scales are 100-µm. SAM image shows a void (black phase) partly surrounded by delamination (white phase) within an alumina dielectric material between two layers of copper.

Figure 2 image

Figure 2 – Cross-section of heat sink showing a layered construction of a thin copper top layer over an alumina dielectric material (white layer) on top of a copper substrate. The crack in the dielectric material is the delamination identified in the SAM inspection.

Figure 3

Figure 3 – CT images of Discontinuity 3 in the form of orthogonal views, depicted by the gray scale image slices, and a clipped, isoview image portraying a 3D rendering of the void.

Figure 4

Figure 4 – Etched metallographic cross-section of Discontinuity 3 showing plastic deformation within the grains of the top copper layer and copper substrate. A copper “uvula” hangs from the top copper layer, and copper “nuggets” rest on the copper substrate. The dark phase between the copper layers is the alumina dielectric material.

Figure 5

Figure 5 – Magnified view of copper “uvula” shown in Figure 3 and Figure 4.

Figure 6

Figure 6 – Magnified view of copper “nuggets” shown in Figure 3 and Figure 4.

Figure 7

Figure 7 – Copper particles found in alumina dielectric material remote from Discontinuity 3 after peeling away the top copper layer from the body of the heat sink.

 

Advertisements

One thought on “A Case Study Using CT Inspection Data

  1. Pingback: Aspen Research Case Study - Using CT Inspection Data - Avonix Imaging

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out /  Change )

Google+ photo

You are commenting using your Google+ account. Log Out /  Change )

Twitter picture

You are commenting using your Twitter account. Log Out /  Change )

Facebook photo

You are commenting using your Facebook account. Log Out /  Change )

Connecting to %s